Word from the CEO

Chiplet technology has recently taken the spotlight in the semiconductor industry as an efficient and elegant solution to the approaching end of Moore's Law. While some industry players have only begun to show interest in the approach, others have already started enabling it by developing new chiplet packaging and interconnect technologies. Current efforts, however, still fall short of truly enabling chiplet productization, as it also requires a new type of SoC infrastructure that considers the impact of chiplet packaging and accounts for their new use cases.

Our company aims to deliver a high-performance, low-cost hub chiplet called Falcon, specifically developed to address the abovementioned requirements. Our Falcon will use a high-bandwidth, low-latency die-to-die interface to allow any external chiplet to connect to its rich infrastructure and take advantage of its high-performance, low-power CPU cluster, NoC bus, abundant memory, highly efficient resource scheduler, and other functionalities.

Developing stand-alone SoC products has always been and will be a considerable barrier for anyone wanting to build a custom accelerator due to the technology and costs involved in assembling the SoC infrastructure around the central accelerator engine. Our Falcon will finally bring the innovation required to remove this barrier and enable our partners and customers to productize their custom SoCs at lower costs and shorter design turn-around time than anyone could imagine.

Il Park, CEO